Process Sense NDIR

Process Sense™ Non-dispersive Infrared Chamber Clean Endpoint

Process Sense™ endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense™ is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). The Process Sense™ gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense™, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.

Features

Reduced chamber clean times
Reduced chamber clean cost
Minimum particle events
Reduced NF3 usage
Reduced power consumption
Increased wafer throughput of CVD tool
Accurate determination of chamber clean endpoint
Low-cost filter-based analyzer

Applications

Chamber clean endpoint for SiF4
Sensitivity to SiF4 down to 1ppm
Simple analog output for reported concentration signal
Silicon Oxides (USG, FSG, PSG, BSG, BPSG)
Silicon Nitrides
Polysilicon
Silane or TEOS processes

Download data sheet for more information