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Process Sense NDIR

Process Sense™ Non-dispersive Infrared Chamber Clean Endpoint

Process Sense™ endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense™ is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). The Process Sense™ gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense™, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.

Features

  • Reduced chamber clean times
  • Reduced chamber clean cost
  • Minimum particle events
  • Reduced NF3 usage
  • Reduced power consumption
  • Increased wafer throughput of CVD tool
  • Accurate determination of chamber clean endpoint
  • Low-cost filter-based analyzer

Applications

  • Chamber clean endpoint for SiF4
  • Sensitivity to SiF4 down to 1ppm
  • Simple analog output for reported concentration signal
  • Silicon Oxides (USG, FSG, PSG, BSG, BPSG)
  • Silicon Nitrides
  • Polysilicon
  • Silane or TEOS processes

Download data sheet for more information