
Features
- Reduced chamber clean times
- Reduced chamber clean cost
- Minimum particle events
- Reduced NF3 usage
- Reduced power consumption
- Increased wafer throughput of CVD tool
- Accurate determination of chamber clean endpoint
- Low-cost filter-based analyzer
Applications
- Chamber clean endpoint for SiF4
- Sensitivity to SiF4 down to 1ppm
- Simple analog output for reported concentration signal
- Silicon Oxides (USG, FSG, PSG, BSG, BPSG)
- Silicon Nitrides
- Polysilicon
- Silane or TEOS processes
Dimensions
Performance Curve
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